AI data centers, EVs, 6G and quantum computing are driving demand for advanced cooling, creating opportunities in liquid, passive, solid-state and cryogenic technologies.

Dublin, Sept. 14, 2026 (GLOBE NEWSWIRE) -- "The Global Market for Active, Passive and Solid-State Cooling 2026-2036" has been added to ResearchAndMarkets.com's offering.

The Global Market for Active, Passive and Solid-State Cooling 2026-2036 provides comprehensive market intelligence on advanced cooling technologies and thermal management materials, including extended forecasts through 2046.

The global cooling market is entering a period of significant transformation as rising power densities, electrification, energy-efficiency requirements and emerging technologies create increasingly complex thermal management challenges. AI data centers, electric vehicles, 6G telecommunications infrastructure, advanced semiconductor packaging and quantum computing systems are accelerating demand for high-performance active, passive and solid-state cooling solutions.

AI and high-performance computing are major growth drivers, with data center rack power densities exceeding 100 kW in demanding deployments. At the same time, electric vehicle manufacturers require advanced battery cooling, power electronics thermal management, cabin climate control and temperature regulation for ADAS sensors. Future 6G communications systems operating at higher frequencies will also require innovative materials and architectures, while quantum computers depend on specialized cryogenic cooling systems capable of maintaining millikelvin operating environments.

The report analyzes established and emerging passive cooling technologies, including thermal interface materials, phase change materials, heat pipes, vapor chambers, radiative cooling coatings, aerogels and hydrogels. It also assesses next-generation solid-state cooling technologies such as thermoelectric, magnetocaloric, electrocaloric, elastocaloric, barocaloric, thermophotonic, phononic and advanced thermionic cooling systems.

Advanced materials are central to the evolution of the global thermal management market. Graphene, carbon nanotubes and nanodiamonds are supporting improvements in thermal conductivity and heat dissipation. Metal-organic frameworks are creating new opportunities for solid-state air conditioning, while metamaterials and metasurfaces are advancing passive daytime radiative cooling, precision chip-level thermal control and thermal cloaking. Hydrogels and aerogels are also gaining attention across electronics, buildings and thermal energy storage applications.

The study delivers detailed global market forecasts segmented by cooling technology, material category, end-use application and region. Coverage spans semiconductor packaging, data center cooling, electric vehicle thermal management, quantum computing cryogenics, 6G communications infrastructure and energy-efficient active cooling. Technology roadmaps, technology readiness assessments, commercialization projections and application suitability analysis provide strategic insight into market development from 2025 through 2046.

Designed for materials suppliers, component manufacturers, cooling system developers, semiconductor companies, system integrators, technology providers and investors, the report identifies commercial opportunities across the rapidly expanding advanced cooling value chain. It also includes profiles of 240 established companies and innovative startups active in global cooling technologies and thermal management materials.

Report coverage includes:

Passive cooling materials, including thermal interface materials, phase change materials, graphene, carbon nanotubes, heat pipes, vapor chambers, radiative cooling paints and coatings, aerogels, hydrogels and metal-organic frameworks.
Solid-state cooling technologies, including thermoelectric, magnetocaloric, electrocaloric, elastocaloric, barocaloric, LED-based thermophotonic, phononic, quantum dot, photonic crystal and thermionic cooling.
Metamaterials and metasurfaces for passive daytime radiative cooling, thermal cloaking, heat spreading and advanced cooling films, supported by global market forecasts through 2036.
Quantum computing cryogenic cooling, including dilution refrigeration, adiabatic demagnetization refrigeration, helium-3-free solutions and cryogenic components.
Semiconductor packaging thermal management, covering TIM1 and TIM1.5 materials, 2.5D and 3D integrated circuits, liquid cooling for high-performance computing, diamond substrates and AI-enhanced thermal design.
6G thermal management materials, including vapor chambers, radiative cooling, thermoelectric cooling and energy harvesting, metamaterials, hydrogels and ionogels.
Data center cooling technologies, including direct liquid cooling, immersion cooling, chip-level cooling, thermoelectric integration and heat recovery systems.
Electric vehicle thermal management for batteries, power electronics, passenger cabins and ADAS sensors.
Active cooling innovations, including electrochromic smart windows, MEMS micro-fans, air-conditioning alternatives and thermal management for energy storage systems.
Global cooling market forecasts from 2025 to 2046 by technology, material, application and region, covering North America, Europe, Asia-Pacific and the Rest of the World.
Technology roadmaps for passive, active and solid-state cooling, including readiness assessments and projected commercialization timelines.
Profiles of 240 companies operating across the global advanced cooling and thermal management market.

Key Topics Covered:

1 EXECUTIVE SUMMARY
1.1 Market Overview
1.1.1 The Global Cooling Market Landscape
1.1.2 Key Materials and Technologies in Passive Cooling
1.1.3 Global Solid-State Cooling Market Size and Growth Projections 2025-2046
1.1.4 Emerging Technologies Cooling Market Opportunity Assessment
1.2 Market Drivers
1.2.1 Electrification and Energy Efficiency Mandates
1.2.2 AI Data Centres and High-Performance Computing
1.2.3 Electric Vehicles and Zero-Emission Transportation
1.2.4 6G Communications Infrastructure
1.2.5 Quantum Computing Growth
1.3 Emerging Materials Overview
1.3.1 Types and Formats of Emerging Carbon Materials for Thermal Cooling
1.3.2 Types and Formats of Emerging Inorganic Compounds
1.3.3 Emerging Polymer and Hybrid Materials
1.4 Passive Versus Active Cooling
1.4.1 Definitions, Operating Principles, and Energy Requirements
1.4.2 Comparative Performance
1.4.3 Cooling People Versus Cooling Things
1.5 Technology Landscape
1.5.1 Established Versus Emerging Solid-State Cooling Technologies
1.5.2 Cooling Toolkit and Potential Winners
1.5.3 Technology Readiness Levels and Commercialisation Timelines
1.5.4 LED-Based Thermophotonic Cooling Performance Benchmarks
1.5.5 Quantum Cryogenic Cooling Requirements and Market Applications
1.6 Applications Roadmap 2025-2046
1.6.1 Near-Term Applications (2025-2030)
1.6.2 Medium-Term Applications (2030-2036)
1.6.3 Long-Term Applications (2036-2046)
1.7 Market Forecasts 2025-2046
1.7.1 Passive Cooling Materials and Technologies
1.7.2 Active Cooling Technologies and Systems
1.7.3 Solid-State Cooling Technologies
1.7.4 Cryogenic Equipment Market
1.7.5 Combined Advanced Cooling Market Summary
1.8 Technology Roadmaps
1.8.1 Passive Cooling Roadmap by Market and by Technology
1.8.2 Active Cooling and Thermal Management Roadmap
1.8.3 Solid-State Cooling Roadmap 2025-2046

2 PASSIVE COOLING MATERIALS AND TECHNOLOGIES
2.1 Principles Employed for Cooling or Prevention of Heating
2.1.1 Conduction
2.1.2 Convection
2.1.3 Radiation
2.1.4 Evaporation
2.1.5 Insulation
2.1.6 Phase Change
2.2 Thermal Interface Materials (TIMs)
2.2.1 What Are TIMs?
2.2.2 Types of TIMs
2.2.3 Thermal Conductivity of TIM Fillers
2.2.4 Comparative Properties of TIMs
2.2.5 Advantages and Disadvantages of TIMs, by Type
2.2.6 Thermal Greases and Pastes
2.2.7 Thermal Gap Pads
2.2.8 Thermal Gap Fillers
2.2.9 Thermal Adhesives and Potting Compounds
2.2.10 Metal-Based TIMs
2.2.10.1 Overview
2.2.10.2 Solders and Low Melting Temperature Alloy TIMs
2.2.10.3 Liquid Metals
2.2.10.4 Solid Liquid Hybrid (SLH) Metals
2.2.10.5 Hybrid Liquid Metal Pastes
2.2.10.6 SLH Created During Chip Assembly (m2TIMs)
2.2.11 TIM Fillers: Trends, Chemistry, and Selection
2.3 Phase Change Materials (PCMs)
2.3.1 Key Properties
2.3.2 Classification
2.3.3 PCM Types and Properties
2.3.4 Organic PCMs
2.3.4.1 Paraffin Wax
2.3.4.2 Non-Paraffins (Fatty Acids, Esters, Alcohols)
2.3.4.3 Bio-Based Phase Change Materials
2.3.5 Inorganic PCMs
2.3.5.1 Salt Hydrates
2.3.5.2 Metal and Metal Alloy PCMs (High-Temperature)
2.3.6 Eutectic PCMs
2.3.7 Encapsulation of PCMs
2.3.7.1 Macroencapsulation
2.3.7.2 Micro/Nanoencapsulation
2.3.7.3 Shape-Stabilised PCMs
2.3.7.4 Self-Assembly Encapsulation
2.3.8 SWOT Analysis for Phase Change Materials for Passive Cooling
2.4 Carbon Materials for Thermal Management
2.4.1 Comparison: Silicone Versus Carbon-Based Polymers
2.4.2 Graphene
2.4.2.1 Graphene as TIM Fillers
2.4.2.2 Graphene Foam and 3D Structures
2.4.2.3 Graphene Films and Heat Spreaders
2.4.3 Carbon Nanotubes (CNTs)
2.4.3.1 Vertically Aligned CNT Arrays
2.4.3.2 CNT Buckypapers
2.4.4 Fullerenes
2.4.5 Nanodiamonds
2.4.6 SWOT analysis for carbon materials for passive cooling
2.5 Metal Organic Frameworks (MOFs)
2.5.1 Structure and Properties
2.5.2 Water Adsorption Cooling Cycles
2.5.3 MOF-Based Adsorption Cooling Systems
2.5.4 Development Stage and Commercialisation Outlook
2.6 Heat Pipes and Vapour Chambers
2.6.1 Technology Description and Operating Principle
2.6.2 Loop Heat Pipes
2.6.3 Vapour Chambers
2.6.4 Flat Plate and Pulsating Derivatives
2.6.5 Emerging Heat Pipe Designs
2.7 Radiative Cooling
2.7.1 Heat Sinks
2.7.1.1 Conventional Heat Sinks
2.7.1.2 Advanced Heat Sinks
2.7.1.3 PCM-Enhanced Latent Heat Sinks
2.7.2 Traditional Radiative Cooling
2.7.3 Building Radiative Cooling
2.7.4 Passive Daytime Radiative Cooling (PDRC)
2.7.4.1 Overview and Mechanism
2.7.4.2 Materials Innovations
2.7.4.3 Commercialisation Requirements
2.7.4.4 Nano-Photonic Film Example
2.7.5 Thermal Louvers
2.7.6 Anti-Stokes Fluorescence Cooling
2.8 Hydrogels for Cooling
2.8.1 Structure
2.8.2 Classification
2.8.3 Formulations and Benefits
2.8.4 Cooling Systems and Applications
2.8.4.1 Evaporative Hydrogel Cooling
2.8.4.2 Hydroceramic Systems
2.8.4.3 Solar Panel Cooling
2.8.4.4 Electronics and Data Centre Cooling
2.8.4.5 Moisture Thermal Battery
2.8.4.6 Smart Windows
2.8.4.7 Aerogel Hydrogel Combined Systems
2.9 Passive Cooling Paints and Coatings
2.9.1 Super-White Paints
2.9.2 Metamaterial-Enhanced Coatings
2.9.3 Self-Cleaning Cooling Coatings
2.9.4 Application Markets
2.10 Aerogels
2.10.1 Silica Aerogels
2.10.1.1 Properties
2.10.1.2 Chemical Precursors
2.10.1.3 Product Forms
2.10.2 SWOT Analysis

3 METAMATERIALS AND METASURFACES FOR THERMAL MANAGEMENT
3.1 Introduction to Metamaterials
3.1.1 Definition and Fundamental Principles
3.1.2 Types of Metamaterials
3.1.3 Metamaterial Landscape by Wavelength
3.1.4 Passive vs Active Metamaterials
3.1.5 Manufacturing Methods
3.2 Thermal Metamaterials
3.2.1 Overview
3.2.2 Types of Thermal Management Metamaterials
3.2.3 Advanced 3D Printing for Thermal Metamaterials
3.2.4 Functionally Graded Materials
3.2.5 Thermoelectric Enhancement via Metamaterials
3.3 Thermal Metamaterial Applications
3.3.1 Static Radiative Cooling Materials
3.3.2 Photonic Cooling
3.3.3 Ultra-Conductive Thermal Metamaterials
3.3.4 Thermal Convective Metamaterials
3.3.5 Thermal Cloaking Metamaterials
3.3.6 Thermal Concentrators
3.3.7 Thermal Diodes
3.3.8 Thermal Expanders and Rotators
3.3.9 Greenhouses and Windows
3.3.10 Industrial Heat Harvesting
3.3.11 Thermal Metalenses
3.3.12 Microchip Cooling
3.3.13 Photovoltaics Cooling
3.3.14 Space Applications
3.3.15 Electronic Packaging
3.3.16 Advanced Cooling Textiles
3.3.17 Automotive Thermal Management
3.4 Passive Daytime Radiative Cooling (PDRC) Metamaterials
3.4.1 Principles and Performance
3.4.2 PDRC Technology Comparison
3.4.3 Transparent PDRC for Buildings
3.4.4 Cooling Films for Power Plants and Industry
3.4.5 Optical Solar Reflection Coatings
3.5 Tunable Metamaterials for Thermal Applications
3.5.1 Overview
3.5.2 Tunable Electromagnetic Metamaterials
3.5.3 Tunable THz Metamaterials
3.5.4 Tunable Optical Metamaterials
3.5.5 Applications of Tunable Metamaterials for Thermal Management
3.6 Thermal Metamaterial Technology Roadmap
3.6.1 Development Timeline
3.6.2 Technology Readiness Levels
3.7 Global Market for Metamaterials
3.7.1 Market Overview
3.7.2 SWOT Analysis
3.7.3 Global Revenues by End-Use Market
3.7.4 Market Opportunity Assessment
3.7.5 Companies in Thermal Metamaterials
3.7.6 Market and Technology Challenges

4 SOLID-STATE COOLING TECHNOLOGIES
4.1 Introduction and Technology Classification
4.2 Value Chain Analysis
4.3 Thermoelectric (Peltier) Cooling
4.3.1 Technology Principles
4.3.2 Thermoelectric Materials
4.3.2.1 Bismuth Telluride
4.3.2.2 Alternative Thermoelectric Materials
4.3.3 Performance Characteristics and Limitations
4.3.4 Applications and Market Penetration
4.3.5 Thermoelectric Market Size
4.3.6 SWOT Analysis
4.4 Magnetocaloric Cooling
4.4.1 Technology Principles and Development Status
4.4.2 Magnetocaloric Materials
4.4.3 Performance Comparison
4.4.4 Commercial Applications and Development Status
4.4.5 Commercialisation Challenges
4.4.6 SWOT Analysis
4.5 Electrocaloric Cooling
4.5.1 Technology Fundamentals
4.5.2 Electrocaloric Materials
4.5.3 Development Status and Commercialisation Timeline
4.5.4 SWOT Analysis
4.6 Elastocaloric and Barocaloric Cooling
4.6.1 Caloric Effects Comparison
4.6.2 Elastocaloric Cooling
4.6.3 Barocaloric Cooling
4.6.4 Engineering Challenges
4.7 LED-Based Thermophotonic Cooling
4.7.1 Principles
4.7.2 Development Status
4.8 Other Emerging Technologies
4.8.1 Phononic Cooling
4.8.2 Advanced Thermionic Cooling
4.8.3 Ionic Wind Cooling
4.9 Comparative Technology Analysis
4.9.1 Technology Roadmap
4.10 Overall Market Segmentation and Sizing
4.10.1 Global Solid-State Cooling Market Overview
4.11 Comparative Technology Analysis
4.11.1 Performance Benchmarking Matrix Across All Technologies
4.11.2 Cost Competitiveness Analysis by Application Segment
4.11.3 Application Suitability Mapping and Temperature Ranges
4.11.4 Technology Roadmap and Convergence Trends
4.11.5 Quantum Technology Integration Capabilities
4.12 Market Forecasts by Technology
4.13 Market Forecasts by End User
4.14 Price Performance Evolution
4.15 Regional Market Analysis
4.16 Market Drivers and Growth Catalysts
4.17 Application-Based Market Segmentation
4.17.1 Cryogenic Applications (sub-100K)
4.17.2 Ultra-Low Temperature Applications (100-150K)
4.17.3 Moderate Cooling Applications (>150K)
4.17.4 Semiconductor Sensor Cooling
4.17.5 Scientific Instrumentation
4.17.6 Medical Devices and Diagnostics
4.17.7 Defence and Aerospace
4.17.8 Consumer Electronics Thermal Management
4.17.9 Data Centre and IT Cooling
4.17.10 Automotive Thermal Systems
4.17.11 Cost Sensitivity and Value Drivers
4.17.12 Technology Adoption Criteria and Decision Factors

5 QUANTUM COMPUTING CRYOGENIC COOLING SOLUTIONS
5.1 Quantum Cryogenic Cooling Technologies
5.1.1 Adiabatic Demagnetisation Refrigeration (ADR)
5.1.1.1 Single-Stage and Continuous ADR (cADR) Systems
5.1.1.2 Paramagnetic Salt Cooling Media
5.1.1.3 Applications in Quantum Computing and Sensing
5.1.2 Dilution Refrigeration
5.1.2.1 Helium-3 Supply and Alternatives
5.1.2.2 Quantum Device Operation Requirements
5.2 Superconducting Cooling Technologies
5.2.1 Josephson Junction Cooling Applications
5.2.2 Trapped-Ion Quantum Computer Cooling
5.2.3 Superconducting Qubit Thermal Management
5.3 Quantum Sensing and Communication Cooling
5.3.1 Single-Photon Detector Cooling Requirements
5.3.2 NV Centre and Quantum Sensor Thermal Management
5.3.3 Optical Quantum Device Cooling Challenges
5.4 Cryogenic Infrastructure and Scaling Challenges
5.5 Cryogenic Component Market Analysis
5.5.1 Market Overview and TAM/SAM/SOM Framework
5.5.2 Component Market Segmentation
5.5.3 Regional Market and Competitive Landscape
5.5.4 Export Controls and Strategic Considerations
5.5.5 SWOT Analysis - Quantum Cryogenic Market

6 THERMAL MANAGEMENT FOR ADVANCED SEMICONDUCTOR PACKAGING
6.1 Advanced Semiconductor Packaging Overview
6.1.1 Evolution of Semiconductor Packaging (2D to Advanced 2.5D and 3D)
6.1.2 Thermal Design Power (TDP) Trends for HPC Chips
6.1.2.1 2.5D and 3D Packaging in GPUs
6.1.3 Power Delivery Challenges
6.2 Thermal Management of High-Power Advanced Packages
6.2.1 Die-Attach Technology
6.2.2 TIM1 and TIM1.5 in 3D Semiconductor Packaging
6.2.3 Liquid Cooling Technologies for HPC
6.2.4 Hybrid Cooling Systems (Air Liquid)
6.3 Emerging Thermal Technologies for Semiconductor Packaging
6.3.1 Carbon Nanotube Thermal Interface Materials
6.3.2 Graphene for Thermal Management
6.3.2.1 Graphene Manufacturing Methods
6.3.2.2 Graphene Composites and Structures
6.3.3 Aerogel-Based Thermal Solutions
6.3.4 Metamaterial Heat Spreaders
6.3.5 Bio-Inspired Thermal Management Approaches
6.4 Thermal Modelling and Simulation
6.4.1 Multi-Physics Simulation Requirements
6.4.2 AI-Enhanced Thermal Design Optimisation
6.4.3 Real-Time Thermal Monitoring Integration
6.5 Cooling Systems for Data Centres
6.5.1 Liquid Cooling and Immersion Cooling
6.5.2 Chip-Level Cooling Approaches
6.5.3 Thermoelectric Cooling Integration
6.5.4 Heat Recovery and Reuse Systems
6.6 Market Forecasts
6.6.1 TIM1 and TIM1.5 Market for Advanced Semiconductor Packaging
6.6.2 Thermal Management Market by Package Type
6.6.3 Geographic Market Distribution
6.6.4 SWOT Analysis - Advanced Semiconductor Packaging Thermal Management

7 THERMAL INTERFACE MATERIALS
7.1 TIM Market by End-Use Sector
7.1.1 Consumer Electronics
7.1.2 Electric Vehicles
7.1.3 Data Centres
7.1.4 5G/6G Communications
7.1.5 ADAS Sensors
7.1.6 Aerospace and Defence
7.1.7 Industrial Electronics
7.1.8 Renewable Energy
7.1.9 Medical Electronics
7.2 Global TIM Market Forecasts, 2022-2036, by Type
7.2.1 Market Overview
7.2.2 Market by Material Type
7.2.3 Geographic Market Analysis
7.2.4 Key Market Trends and Drivers

8 ACTIVE COOLING TECHNOLOGIES AND SYSTEMS
8.1 Emerging Opportunities
8.1.1 Buildings, Windows, and Greenhouses
8.1.2 Electric Vehicles and Large Batteries
8.1.3 Long-Duration Energy Storage
8.1.4 Processors and Telecommunications
8.2 Active Cooling Reinvented
8.2.1 Conditioning Alternatives
8.2.2 Powered Windows and Facades
8.2.3 Fan Cooling Reinvented
8.3 Active Cooling for Batteries and Energy Storage
8.3.1 Battery Thermal Management Systems
8.3.2 Compressed Air and Liquid Air Energy Storage Thermal Opportunities
8.4 Multi-Mode Integrated Cooling
8.4.1 Integrated Cooling and Energy Recovery (ICER)
8.4.2 Smart Windows and Dynamic Building Envelopes
8.4.3 Super-White Paint and Radiative Cooling Coatings
8.4.4 Electronics Integration

9 6G COMMUNICATIONS THERMAL MATERIALS
9.1 6G Thermal Management Challenges
9.1.1 Phase One (Incremental) and Phase Two (Disruptive) 6G
9.1.2 Severe New Microchip Cooling Requirements
9.1.3 Cooling 6G Smartphones, Base Stations, and Infrastructure
9.2 PDRC for 6G Infrastructure
9.3 Phase Change and Caloric Cooling for 6G
9.4 Thermoelectric Cooling and Harvesting for 6G
9.5 Evaporative, Heat Pipe and Hydrogel Cooling for 6G
9.5.1 Heat Pipes and Vapour Chambers
9.5.2 Hydrogel Cooling for 6G
9.6 TIMs and Conductive Cooling for 6G
9.6.1 Conductive Cooling for 6G
9.7 Advanced Heat Shielding, Thermal Insulation and Ionogels for 6G
9.7.1 Ionogels for 6G
9.8 Thermal Metamaterials for 6G
9.8.1 Reconfigurable Intelligent Surfaces (RIS) and Thermal Management

10 COMPANY PROFILES (244 COMPANY PROFILES)

11 APPENDIX
11.1 Report Scope and Objectives
11.1.1 Markets and Technologies Covered
11.1.2 Geographic Scope and Regional Definitions
11.1.3 Forecast Period and Base-Year Assumptions
11.2 Research Methodology
11.2.1 Primary Research: Expert Interviews and Industry Questionnaires
11.2.2 Secondary Research: Patent Analysis, Company Filings, Academic Literature
11.2.3 Bottom-Up and Top-Down Market Sizing Approach
11.2.4 Data Triangulation and Validation Procedures
11.3 Definitions and Terminology
11.3.1 Cooling Category Definitions
11.3.2 Temperature Regime Classifications
11.3.3 Technology Readiness Level (TRL) Definitions

A selection of companies mentioned in this report includes, but is not limited to:

3M
ABIS Aerogel Co.
Accelcius
ADA Technologies
Advanced Thermal Solutions
AegiQ
Aerofybers Technologies
aerogel-it GmbH
Aerogel Technologies
Aerogel UK
AI Technology
Aismalibar
Akash Systems
Anyon Systems
Barocal
Carbice
Corintis
Eaton
Frore Systems
Krosslinker
Magnotherm
Phononic
Sophia Space

For more information about this report visit https://www.researchandmarkets.com/r/jia0th

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Global Active, Passive and Solid-State Cooling Market Poised for Growth Through 2036 as Energy Efficiency, AI Data Centers and Advanced Electronics Drive Innovation