<table name="logo_release" border="0" cellspacing="10" cellpadding="5" align="right">   <tbody>    <tr>     <td><img src="https://mma.prnasia.com/media2/2663859/TWSC_Logo.jpg?p=medium600" border="0" alt="" title="logo" hspace="0" vspace="0" width="118" /></td>    </tr>   </tbody>  </table>  <p><span class="legendSpanClass">TAIPEI</span>, <span class="legendSpanClass">June 3, 2026</span> /PRNewswire/ -- COMPUTEX 2026 opened in Taipei on June 2 under the theme &quot;AI Together&quot;. TWSC showcased its full-stack AI storage solutions to demonstrate systematic storage competence covering data centers, smart terminals and various IoT use cases.</p>  <div class="PRN_ImbeddedAssetReference" id="DivAssetPlaceHolder1">   <p style="TEXT-ALIGN: center; WIDTH: 100%"> <a href="https://mma.prnasia.com/media2/2993896/1.html" target="_blank" rel="nofollow" style="color: #0000FF"> <img src="https://mma.prnasia.com/media2/2993896/1.jpg?p=medium600" title="TWSC Presents Full-Stack Storage Solutions at COMPUTEX 2026 for Diverse Application Needs of the “AI Together” Era" alt="TWSC Presents Full-Stack Storage Solutions at COMPUTEX 2026 for Diverse Application Needs of the “AI Together” Era" /> </a> <br /><span>TWSC Presents Full-Stack Storage Solutions at COMPUTEX 2026 for Diverse Application Needs of the “AI Together” Era</span></p>  </div>  <p>For data center and enterprise-grade AI, TWSC underpins its technology with self-developed H3361 dual-mode enterprise SSD controller and delivers an all-in-one enterprise storage lineup including TE5133 PCIe SSD, TS3160 SATA SSD and DDR5 RDIMM modules, catering to AI compute clusters with high-concurrency access and low-latency storage performance.</p>  <p>For smart terminals and personal computing, its PCIe 5.0 SSD comes in DRAM-cached and DRAM-less variants for high-end gadgets and power-efficient thin devices respectively. DDR5 U/SO-DIMM memory modules equipped with PMIC and On-die ECC also support optional CKD configuration to boost multitasking efficiency and operational stability.</p>  <p>For embedded and edge hardware, TWSC's first mass-produced QLC NAND UFS ranges from 128GB to 1TB, delivering cost-effective and dependable storage for AI-enabled endpoints.</p>  <p>For mobile office, video backup and consumer electronics scenarios, TWSC supplies flexible customized solutions including PSSD, mUDP, UDP and PCBA.</p>  <p>Leveraging coordinated smart manufacturing bases in Futian and Guangming, TWSC integrates large-scale shipment with advanced product validation to drive widespread commercialization of AI across diverse sectors via comprehensive storage technologies.</p>  <div class="PRN_ImbeddedAssetReference" id="DivAssetPlaceHolder2">   <p> </p>  </div>

TWSC Presents Full-Stack Storage Solutions at COMPUTEX 2026 to Meet Diverse Demands of "AI Together" Scenarios

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